无线电工程

测向需要使用多个接收变频通道,传统的设计将各个变频链路和本振模块独立封装,相互间采用电缆连接,很难进一步减小架构体积。采用低温共烧陶瓷(LTCC)工艺结合薄膜工艺实现该前端组件,集成了6路Ka频段毫米波变频通道以及本振倍频分路,有效地减少整个组件的体积。优化设计后的LTCC层间互联以及穿层互联能够代替同轴互连,在满足传输特性的同时解决了小型化多通道集成带来的电磁兼容问题。最终实现的3次变频6通道接收前端组件,噪声系数小于13.5 d B,增益大于41 d B,整体尺寸为170 mm×170 mm×20 mm。测试结果表明,采用LTCC工艺实现的多通道前端,能够在满足指标的前提下实现小型化。

Multi-channel receiver module is required in direction finding area.In traditional design,it is hard to be miniaturized,because front-ends and local oscillators are packaged separately using cables as interconnectors.In this paper,LTCC process associated with thin film technology is adopted in developing a 6-channel Ka-band module including LO to effectively reduce the module size. By choosing LTCC cross-layer interconnection instead of cables,problems such as embedding and EMC are solved while the electric performance remains satisfactory.The module has NF less than 13.5 d B,more than 41 d B gain and is integrated in 170 mm×170 mm×20 mm volume. The test result shows the multi-channel module using LTCC process can realize miniaturization while satisfying the performance requirements.